LG Innotek, AP module for vehicle ADAS and digital cockpit 'launch announcement'

LG Innotek is making a full-scale foray into the electric components market with its automotive application processor modules (AP modules).



LG Innotek announced on the 19th that its goal is to mass-produce semiconductor components that are installed inside vehicles to integrate and control automotive electronic systems such as advanced driver assistance systems (ADAS) and digital cockpits starting by the end of this year.



LG Innotek employees are introducing automotive AP modules. [Photo = LG Innotek]



The demand for AP modules is rapidly increasing every year due to the development of connected cars such as autonomous driving. This is because the PCB-based semiconductor chips used in existing vehicles have limitations in processing the massive data of advanced ADAS and digital cockpits equipped with high-resolution displays.



According to the industry, the number of AP modules installed in vehicles worldwide is expected to increase by 22% annually from 33 million this year to 113 million in 2030.



LG Innotek's automotive AP modules are characterized by their ability to integrate multiple functions into a palm-sized package.



A single module measuring 6.5 cm x 6.5 cm contains more than 400 components, including an integrated chipset (SoC), memory semiconductors, and power management integrated circuits (PMIC) that control various systems such as data and graphic processing, display, and multimedia.



Applying this product can reduce the size of the main board compared to existing ones, increasing the design freedom of customers who have completed the vehicle. In addition, since the components inside the module are highly integrated, the signal distance between the components is shortened, further improving the control performance of the module.



LG Innotek plans to continue to advance its vehicle AP modules. It plans to improve the module's heat dissipation performance so that it can operate at up to 95 °C within this year, while significantly shortening the AP module development period through warpage prediction using virtual simulation.



Vehicle AP module developed by LG Innotek. [Photo = LG Innotek]



LG Innotek is currently actively promoting it to global semiconductor companies such as those in North America, aiming for its first mass production in the second half of this year.



CEO Moon Hyuk-soo said, "The development of the vehicle AP module has enabled us to accelerate the expansion of our semiconductor components business," and added, "LG ​​Innotek will continue to introduce products that provide differentiated customer value and grow into a trusted innovation partner for global customers."



Meanwhile, LG Innotek aims to foster its semiconductor components business to over KRW 3 trillion in annual sales by 2030, focusing on high value-added semiconductor substrates such as radio frequency package systems (RF-SiP) and flip-chip ball grid arrays (FC-BGA) and vehicle AP modules.





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