US Micron hires former TSMC chairman... "Catching up with SK Hynix HBM4"
Micron, the world's third-largest memory semiconductor company, has appointed the former chairman of Taiwan's TSMC to its board of directors. This
is interpreted as an intention of Micron, a latecomer in high-bandwidth memory (HBM), to strengthen its partnership with TSMC and quickly catch up with market leader SK Hynix.
Micron's Texas headquarters. [Photo = Micron]
According to industry sources on the 6th, Micron announced on its homepage on the 5th (local time) that it had appointed Mark Liu, former chairman of TSMC, to its board of directors.
Former Chairman Liu served as president and co-CEO (CEO) of TSMC from 2013 to 2018, and then as chairman until last year, leading TSMC for over 30 years and is evaluated to have raised it to the ranks of the world's largest foundry (semiconductor contract manufacturing) companies.
Sanjay Mehrotra, CEO of Micron, said, "Former Chairman Liu's experience will be invaluable in leading Micron as we capitalize on AI-driven growth opportunities and expand our business from data center to edge."
Micron's strengthened partnership with TSMC is expected to be aimed at enhancing the capabilities of its upcoming custom product, HBM4 (6th generation).
TSMC connects the HBM it receives from memory companies with NVIDIA's graphics processing units (GPUs) to create AI accelerators.
In particular, starting with HBM4, the foundry process is applied to the logic die, which serves as the brain of HBM, and collaboration with TSMC is virtually essential for SK Hynix and Micron, which do not have their own foundry capabilities.
Starting with HBM4, the foundry process is applied to the logic die, which serves as the brain of HBM, and collaboration with TSMC is virtually essential for SK Hynix and Micron, which do not have their own foundry capabilities.
SK Hynix is already building a 'one-team' system with TSMC, aiming for the development and mass production of HBM4 products in the second half of this year.
Micron is currently the second company to supply HBM3E 8-layer products to NVIDIA, following SK Hynix, and has set a goal of mass production of HBM4 products within two years.
https://www.inews24.com/view/blogger/1820689
is interpreted as an intention of Micron, a latecomer in high-bandwidth memory (HBM), to strengthen its partnership with TSMC and quickly catch up with market leader SK Hynix.
Micron's Texas headquarters. [Photo = Micron]
According to industry sources on the 6th, Micron announced on its homepage on the 5th (local time) that it had appointed Mark Liu, former chairman of TSMC, to its board of directors.
Former Chairman Liu served as president and co-CEO (CEO) of TSMC from 2013 to 2018, and then as chairman until last year, leading TSMC for over 30 years and is evaluated to have raised it to the ranks of the world's largest foundry (semiconductor contract manufacturing) companies.
Sanjay Mehrotra, CEO of Micron, said, "Former Chairman Liu's experience will be invaluable in leading Micron as we capitalize on AI-driven growth opportunities and expand our business from data center to edge."
Micron's strengthened partnership with TSMC is expected to be aimed at enhancing the capabilities of its upcoming custom product, HBM4 (6th generation).
TSMC connects the HBM it receives from memory companies with NVIDIA's graphics processing units (GPUs) to create AI accelerators.
In particular, starting with HBM4, the foundry process is applied to the logic die, which serves as the brain of HBM, and collaboration with TSMC is virtually essential for SK Hynix and Micron, which do not have their own foundry capabilities.
Starting with HBM4, the foundry process is applied to the logic die, which serves as the brain of HBM, and collaboration with TSMC is virtually essential for SK Hynix and Micron, which do not have their own foundry capabilities.
SK Hynix is already building a 'one-team' system with TSMC, aiming for the development and mass production of HBM4 products in the second half of this year.
Micron is currently the second company to supply HBM3E 8-layer products to NVIDIA, following SK Hynix, and has set a goal of mass production of HBM4 products within two years.
https://www.inews24.com/view/blogger/1820689
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